Constantin Enke, M. Sc.

Constantin Enke, M. Sc.

  • Gotthard-Franz-Straße 8
    76131 Karlsruhe

Research topics

  • Communication in heterogeneous robotic systems
  • Modular Material Handling
  • Decentralized systems

Projects

Background

since 2021

Institut​e for Material Handling and Logistics (IFL)
Research Associate

2018-2021

Institut​e for Material Handling and Logistics (IFL)
Student Assistant

2018-2021

Karlsr​uher Institute for Technology (KIT)
Study of Mechanical Engineering (M. Sc.)

2017-2019

Simus Systems GmbH
Working student in project management

2014-2018

Karlsr​uher Institute for Technology (KIT)
Study of Mechanical Engineering (B. Sc.)

 

Lectures

 

Thesis topics

  • Click here for a list of currently available topics.

Publications


Decentralized Cooperative Transport in Heterogeneous Robot Fleets Through Four Levels of Communication based on Omni-Curve-Parameters
Brenner, C.; Enke, C.; Schumacher, P.; Schröppel, M.; Schulz, R.; Furmans, K.
2023. Logistics journal / Proceedings. doi:10.2195/lj_proc_brenner_en_202310_01
Flexibility and Changeability for Software-Defined Manufacturing
Martin, M.; Behrendt, S.; Enke, C.; Tutsch, H.; Peukert, S.; Lanza, G.
2023. Production Processes and Product Evolution in the Age of Disruption : Proceedings of the 9th Changeable, Agile, Reconfigurable and Virtual Production Conference (CARV2023) and the 11th World Mass Customization & Personalization Conference (MCPC2023), Bologna, Italy, June 2023. Hrsg.: F. Galizia, 373–380, Springer International Publishing. doi:10.1007/978-3-031-34821-1_41
Classified AGV Material Flow and Layout Data Set for Multidisciplinary Investigation
Sperling, M.; Schulz, B.; Enke, C.; Giebels, D.; Furmans, K.
2023. IEEE Access, 11, 94992–95007. doi:10.1109/ACCESS.2023.3308216
PropS: Towards Proprioception in Cyber-Physical Production Systems by Means of Collaborative Localization
Klein, J.-F.; Enke, C.; Ries, M.
2022. 2022 IEEE International Systems Conference (SysCon): 25–28 April 2022, Montreal, QC, Canada, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SysCon53536.2022.9773887